As the global digitalisation process continues to advance, interconnection traffic between data centres is growing at an average annual rate of about 30% (refer to IDC and other organisations' forecasts), and emerging applications such as AI training, real-time analytics, and cloud natives are driving the demand for east-west bandwidth to continue to rise. At the same time, DC architecture presents two major evolutionary trends:
Edge expansion: core data centres are gradually distributed to edge nodes, leading to a rapid rise in demand for DCI in metropolitan areas;
Cross-domain collaboration: the demand for disaster recovery and resource sharing between data centres has increased, and long-distance DCI architectures are facing higher-performance requirements.
In this context, traditional OTN solutions are difficult to meet the demands of new DCI scenarios due to deployment complexity, limited expansion, low energy efficiency and other issues.
Large size, restricted deployment: centralised electrical cross-design equipment usually requires multiple racks, making it difficult to adapt to the space, power and thermal constraints of IDC environments;
Insufficient flexibility: the optical layer is highly coupled with the service layer, with fixed wavelengths and rates, and weak capacity expansion and adaptation capabilities;
High energy consumption: traditional 400G coherent modules consume more than 12W, and the long-term operation of the whole machine puts significant OPEX pressure;
Closed ecosystems: Some systems use proprietary hardware and private protocols, limiting third-party compatibility and rapid deployment.
Designed on the principles of openness, high density, and energy efficiency, Sintai's OTNS8600-DCI series breaks through traditional bottlenecks in terms of architecture, power consumption, scalability, and interoperability, helping customers to build flexible and efficient next-generation data centre interconnection networks.
Single-fibre 32×800G: adopting PM-16QAM modulation and C-band expansion, single-fibre capacity can reach 25.6T;
Multiple modulation compatibility: supports 800G PM-16QAM (over 600km) and 400G QPSK (up to 2000km) to meet the needs of metro/long-distance scenarios;
Intelligent rate matching: supports 100G~800G rate selection on demand, improving network adaptability.
High-density design: 1U/2U box-type device, single machine weight <20kg, suitable for high-density IDC rapid deployment;
On-demand expansion: adopting distributed architecture, supporting modular card insertion and flexible capacity expansion, reducing the threshold of initial investment;
Green and energy-saving: adopting silicon optical chip, the typical power consumption of 800G module is controlled within 30W, and the power consumption of the whole machine is about 40% lower than that of traditional solutions.
Multi-vendor compatibility: Optical layer equipment supports Sintai and third-party systems for mixed networking, reducing replacement costs;
Standardised interfaces: support for NETCONF/YANG southbound protocol, easy to dock existing SDN controllers;
Flexible spectrum shaping: adjust spectrum resource allocation according to link conditions to achieve capacity/distance dynamic optimisation.
Scenarios | Challenges | OTNS8600-DCI Solution | Customer Benefits |
AI cluster interconnection | High training data synchronisation latency | 800G high-speed hard pipes | Provides large bandwidth transmission capacity to meet the high throughput demand of AI clusters |
Multi-cloud architecture convergence | Inflexible cross-cloud traffic scheduling | SDN control + open interfaces for dynamic bandwidth provisioning | Reduces interconnection costs and enhances bandwidth resilience |
Edge DC deployment | Space, power constraints | 1U compact design + high voltage DC power support | Reduces deployment cycle and increases deployment density |
Sintai will continue to promote the innovation and upgrading of DCI products to build a future-oriented, open, efficient and green optical network interconnection platform for customers.